DCAMM Seminar - Mechanics-guided Deterministic 3D Assembly

A DCAMM seminar No. 737 will be presented by

Professor Yonggang Huang
Departments of Civil and Environmental Engineering,
Mechanical Engineering, and Materials Science and Engineering,
Northwestern University, Evanston, IL, 60208, USA.



Complex three-dimensional (3D) structures in biology (e.g., cytoskeletal webs, neural circuits, and vasculature networks) form naturally to provide 
essential functions in even the most basic forms of life.  Compelling opportunities exist for analogous 3D architectures in human-made devices, but design options are constrained by existing capabilities in materials growth and assembly.  We report routes to previously inaccessible classes of 3D constructs in advanced materials, including device-grade silicon [1].  The schemes involve geometric transformation of 2D micro/nanostructures into extended 3D layouts by compressive buckling.  Designs inspired by kirigami/origami [2,3] and/or releasable multilayers [4] enable the formation of mesostructures with a broad variety of 3D geometries, either with hollow or dense distributions.  Demonstrations include experimental and theoretical studies of more than 100 representative geometries, from single and multiple helices, toroids, and conical spirals to structures that resemble spherical baskets, cars, houses, cuboid cages, starbursts, flowers, scaffolds, each with single- and/or multiple-level configurations. Morphable 3D mesostructures whoese geometries can be elastically altered can be further achieved via nonlinear mechanical buckling, by deforming the elastomer platforms in different time sequences [5].  We further introduce concepts in physical transfer, patterned photopolymerization and non-linear plasticity to enable integration of 3D mesostructures onto nearly any class of substrate, with additional capabilities in access to fully or partially free-standing forms, all via mechanisms quantitatively described by theoretical modeling [6].  Compatibility with the well-established technologies available in semiconductor industries suggests a broad range of application opportunities [7].  Illustrations of these ideas include their use in building 3D structures as radio frequency devices for adaptive electromagnetic properties [5], as open-architecture electronic scaffolds for formation of dorsal root ganglion (DRG) neural networks [6], as ultra-stretchable interconnects for soft electronics [8] and as catalyst supports for propulsive systems in 3D micro-swimmers with geometrically controlled dynamics [6].



[1]     Xu et al., 2015. Science, 347, pp.154-159.

[2]     Zhang et al., 2015. PNAS, 112, pp.11757-11764.

[3]     Yan et al., 2016. Advanced Functional Materials, 26, pp.2629-2639.

[4]     Yan et al., 2016. Science Advances, 2, pp.e1601014.

[5]     Fu et al., 2018. Nature Materials, 17, pp. 268-276.

[6]     Yan et al., 2017. PNAS, 114, pp. E9455-E9464.

[7]     Zhang et al., 2017. Nature Reviews Materials, 2, pp. 17019.

[8]     Jang et al., 2017. Nature Communications, 8, pp.15894.



Danish pastry, coffee and tea will be served 15 minutes before the seminar starts.

All interested persons are invited.



Thu 28 Mar 19
13:00 - 13:45



Building 414, room 065E
Technical University of Denmark
3 JUNE 2020